Heatsinks are available ranging between 19 and 250mm. (read more)

These Activie Cooling Modules provide wide thermal resistance range from 0.35°C/W to 2°C/W. Each module uses one of OLC's world smallest series crossflow fans to achieve linear air velocity above 600ft/min flow through all heat sink fins. It provides very predicable cooling results. Try them to see different! (read more)

At Thermal Solutions International, they believe in providing a complete heatsink. While many of our heatsinks are completed after machining or plating, they can also accommodate their customers whose heatsinks require that extra bit of attention. That's why they offer full assembly and integration of hardware and/or thermal interface materials to any product they sell. (read more)

While aluminum is the most prominently used material for heatsinks, copper is offered for extreme heat dissipation. With a thermal transfer rate almost double that of a comparable 6063 aluminum heatsink, a copper heatsink is an outstanding choice for spreading heat quickly from the heat source to the copper fins and into the surrounding air. (read more)

To effectively dissipate damaging heat from IC and discrete semiconductor chips Thermal Solutions International offers full machinability of heat spreaders. Heat spreader technology was developed to cool a concentrated area of high temperature and have that heat be distributed over a larger area, which in turn reduces the overall temperature of the chip. (read more)

Thermal Solutions International, Inc. also specializes in low power surface mount and BGA (Ball Grid Array) Heatsinks. These heatsinks are offered in either stamped or extruded aluminum form and can be plated to any surface finish required. (read more)

Thermal Solutions International, Inc. manufactures a wide array of DC/DC Converter Heatsinks. Their DC/DC Converter Heatsinks are optimized to effectively dissipate heat and increase converter reliability in a varied range of environments. (read more)

A bonded fin heat sink removes the design limiting fin extrusion ratio found in extruded heat sinks. Typical extrusion fin ratios at VEP are generally from 4:1 up to 16:1. However, VEP currently produces a bonded fin heat sink with a ratio of 44:1.Ratios higher than 44:1 are possible as well. (read more)

TSI's business model is primarily built around heatsinks but we consistently manufacture other products made from various types of metals. One of our other fields of expertise is in sheet metal production, forming, and punching. (read more)

STACI Corporation specializes in providing Thermal Management Solutions for customers around the world. STACI has developed a full range of heat sink products designed to provide a total thermal solution for any application. Standard heat sinks as well as custom designed heat sinks are offered. (read more)