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IC Package Type
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Your choices are...
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PBGA
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Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
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TBGA
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Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
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CSP
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Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
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UCSP
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Ultra chip scale package (UCSP).
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FLGA
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Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
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QFP
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Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
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LQFP
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Low quad flat package (LQFP).
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TQFP
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Thin quad flat package (TQFP).
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SOP
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Small outline package (SOP).
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SOIC
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Small outline integrated circuit (SOIC).
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TSOP Type I
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Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
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TSOP Type II
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Thin small outline package (TSOP), Type II is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
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SSOP
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Shrink small outline package (SSOP).
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TSSOP
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Thin shrink small outline L-leaded package (TSSOP).
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VSSOP
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Very thin shrink small outline package (VSSOP).
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TVSOP
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Thin very small outline package (TVSOP).
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SOJ
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Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
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HSOF
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Small outline flat-leaded package with heat sink (HSOF).
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PLCC
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Plastic leaded chip carrier (PLCC).
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LCCC
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Leadless ceramic chip carrier (LCCC).
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DIP
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Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
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CDIP
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Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
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PDIP
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Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
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SIP
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Single in-line package (SIP).
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SDIP
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Shrink dual in-line package (SDIP).
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SZIP
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Shrink zigzag in-line package (SZIP).
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Other
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Other unlisted, specialized, or proprietary IC packages.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Production Status
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Your choices are...
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Full Production
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Devices are currently being manufactured.
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Discontinued
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Devices are no longer available from the manufacturer, but may still be found in the supply chain.
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In Development
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Devices are in development and not yet available.
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New Product
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Devices are new products that have been announced by the manufacturer.
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Other
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Other unlisted production status.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Screening Level
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Your choices are...
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Commercial
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Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications.
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Industrial
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Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications.
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Military
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Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications.
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Other
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Other unlisted screening levels.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Packing Method
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Your choices are...
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Tape Reel
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Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP).
Typically, carrier tape is made from a polystyrene (PS) or PS-laminate film with a uniform film thickness between 0.2 mm to 0.4 mm. Carrier tape design is defined largely by component length, width, and thickness. Cover tape is made from a polyethylene teraphthalate (PET) film or film laminate with an adhesive applied to the underside of the film. This adhesive is usually heat and pressure sensitive to ensure a positive, consistent seal between the carrier tape and the cover tape. The reels that contain the composite tape are typically made of polystyrene and have one, two, or three parts. Reel dimensions meet EIA-481-1, EIA-481-2, and EIA-481-3 standards.
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Tray / Rail
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Components are packed in trays (rails) that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays.
To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks.
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Shipping Tube / Stick Magazine
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Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.
To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type.
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Bulk Pack
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Components are distributed as individual parts.
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Other
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Other unlisted packing methods.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Pin Count
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The number of pins in package.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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