Telecom Transformers Specifications

Standards / Compliance



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	RoHS Compliant		Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
	ANSI		The American National Standards Institute (ANSI) is the administrator and coordinator of the U.S. private-sector voluntary standardization system. It includes nearly 1000 company, organization, government agency, institutional, and international members.
	CSA		Products that bear a CSA Mark have been tested by the Canadian Standards Association (CSA) and meet applicable standards for safety and/or performance. These standards are written and administered by organizations such as the American National Standards Institute (ANSI), Underwriters Laboratories (UL), and CSA International. CSA Marks may appear alone or with indicators. CSA Marks that appear alone are used with products certified primarily for the Canadian market, to the applicable Canadian standards. CSA Marks that appear with the indicators “C” and “US” or “NRTL/C” is used with products certified for both the U.S. and Canadian markets, to the applicable U.S. and Canadian standards.
	IEC		The International Electrotechnical Commission (IEC) is a global, non-profit organization that develops and maintains voluntary quality, safety, and performance standards for electrical materials, products, and systems The IEC also publishes standards for the electronics and telecommunications industries. The IEC’s membership consists of the electrotechnical standards organizations from each of its 51 member nations. The American National Standards Institute (ANSI) represents the United States.
	MIL-STD		Transformers are manufactured and tested according to U.S. military standards (MIL-STD).
	UL		Underwriters Laboratories (UL) is a non-profit organization that tests components, systems, and materials according to its published standards for safety. Products that receive UL approval bear a UL Mark.
	TUV		TÜV Rheinland/Berlin-Brandenberg provides third-party product testing, system assessment, and certification services. TÜV Rheinland of North America is a member of the TÜV Rheinland Group and accredited by national organizations such as the American National Standards Institute (ANSI) and the Standards Council of Canada (SCC). Products that bear the TUVus Mark are certified for the U.S. market. Products that bear the cTUV Mark are certified for both the U.S. and Canadian markets.
	VDE		Verband Deutscher Elektrotechniker (VDE), the Association of German Electrical Engineers, is a non-profit testing institute that publishes standards and certifies electrical and electronic components. The VDE Mark indicates conformity with VDE, European Union (EU), and internationally harmonized standards. It confirms compliance with the protective requirements of the applicable EU directives.
	WEEE Compliant		Waste Electrical and Electronics Equipment (WEEE) is a European Union (EU) directive regarding the reuse, recycling and recovery of electrical and electronic equipment. WEEE establishes requirements and criteria for collection, treatment, recycling and recovery activities. It also makes producers responsible for financing these efforts. Retailers and distributors must provide consumers with a way to return used or obsolete equipment at no charge.
	Other		Other agencies that test or certify electrical, electronic or electrotechnical products.
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Packaging Characteristics


	Package Type:
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	Surface Mount Technology (SMT)		Surface mount technology (SMT) adds components to a printed circuit board (PCB) by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux. With careful placement, SMT components on solder paste remain in position until elevated temperatures, usually from an infrared oven, melt the paste and solder the component leads to the PCB pads. Industry-standard pick-and-place equipment can mount SMT components quickly, accurately, and cost-effectively. SMT is a widely used alternative to mounting processes that insert pins or terminals through holes and solder leads into place on the opposite side of the board.
	Flat Pack (FPAK)		Flat pack (FPAK) devices have gull wing or flat leads on two or four sides. They provide exceptional thermal and electrical performance and are available in cavity-up and cavity-down configurations. Flat pack devices are typically ceramic, hermetic, and surface-mounted. They are available in a variety of body sizes and pin counts.
	Through Hole Technology (THT)		Through hole technology (THT) mounts components on a printed circuit board (PCB) by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
	Connectorized		Connectorized devices attach with coaxial or other types of connectors.
	Waveguide Assembly		Waveguide assemblies are used in microwave waveguide systems. They consist of a hollow metallic conductor with a rectangular, elliptical, or circular cross-section. Some conductors contain solid or gaseous dielectric materials.
	DIP		Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
	SIP		Single in-line package (SIP) is a semiconductor package which has only one row of pins.
	SOIC		Small outline integrated circuit (SOIC).
	Other		Other unlisted, specialized, or proprietary package.
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	Packing Method
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	Tape Reel		Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP).
	Tray		Components are packed in trays that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks.
	Tube		Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.
	Bulk Pack		Components are distributed as individual parts.
	Other		Other unlisted, specialized or proprietary packing methods.
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Part #	Distributor	Manufacturer	Product Category	Description
553-1173-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1177-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1174-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1169-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1449-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E2
553-1452-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM SINGLE T3/E4
553-1453-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM SINGLE T3/E3
553-1166-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1176-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM DUAL T1/E1
553-1182-ND	Digi-Key	Pulse	Transformers	TRANSFORMER TELECOM SINGLE T3/E3