IC Sockets and Interconnect Components Specifications

General Specifications


	Package Type
	Your choices are...
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	SIP		Single in-line package (SIP).
	DIMM / SO-DIMM		Dual in-line memory module (DIMM) is a small circuit board that holds random-access memory (RAM) chips and is capable of transferring 64 bits. Small outline dual in-line memory modules (SO-DIMMs) are smaller and thinner than standard DIMMs.
	SIMM		Single in-line memory module (SIMM) is a small circuit board that holds random-access memory (RAM) chips and is capable of transferring 32 bits.
	LGA		Land-grid array (LGA).
	PGA		Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern.
	IPGA		Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA.
	QFN		Quad flat non-leaded package (QFN). Also known as QFNL.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	PLCC		Plastic leaded chip carrier (PLCC).
	SOIC / SOP		Small outline integrated circuit (SOIC).
	TO		Transistor outline (TO) sockets are designed to accept transistors. There are many variations. For example, TO-3 has three pins, TO-5 has 5 pins, etc.
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	VSSOP		Very thin shrink small outline package (VSSOP).
	Receptacle		Sockets are mounting board receptacles.
	Display Socket		Sockets are used for installing LEDs, incandescent lamps, switches, and other display devices.
	ZIP / SZIP		Shrink zigzag in-line package (SZIP).
	Test / Prototyping Socket		Sockets are used for testing or prototyping purposes.
	Other		Other unlisted or proprietary socket types.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Mounting
	Your choices are...
	SMT		Surface Mount Technology (SMT) sockets are soldered to the PC board traces. Unlike PC mount sockets, surface mount sockets do not require holes drilled in the PC board.
	Through-hole		In Through Hole Technology (THT), components are mounted on printed circuit boards by inserting component leads through holes in the board and then soldering.
	Press-fit		With press-fit technology the pins of the connectors are not soldered into the PCB (thus avoiding heat stress) but rather are 'pushed (pressed)' into the PCB.
	Swage		Swaging is a forming technique in which the metal is deformed into its final shape by high pressure.
	Solder		The pins or receptacles are soldered to the pc board.
	Other		Other unlisted socket style.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Performance


	Voltage Rating		The maximum operating voltage recommended for a given wire in a given situation. Generally expressed in volts.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Current Rating		The maximum continuous electrical flow of current recommended for a given wire in a given situation. Generally expressed in amperes.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Insulation Resistance		Insulation resistance is the electric resistance between two conductors separated by an insulating material.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Dielectric Withstanding Voltage		Maximum potential gradient that a dielectric material can withstand without failure. The value obtained for the dielectric strength will depend on the thickness of the material and on the method and conditions of test.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Contact Resistance		Contact resistance is the measurement of electrical resistance of mated contacts when assembled in a connector under typical service use. Electrical resistance is determined by measuring from the rear of the contact area of one contact to the rear of the contact area of its mate (excluding both crimps) while carrying a specified test current. Overall contact resistance would be the wire-to-wire measurement.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Operating Temperature:		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Contacts


	Contact / Pin Type
	Your choices are...
	Low Profile Pins		Standard, low height, pins.
	Solder Tail Pins		Pins build to allow for easy soldering or for other applications.
	Wire Wrap Pins		Electrical connections are made using a solderless wrap. Connection is achieved by wrapping a solid stripped or unstripped wire with a special tool onto a wrap post. A technique of connecting stripped solid wire to a terminal post containing a series of sharp edges by winding the wire around the terminal.
	Straight Pins		The pins terminate in both sides of the socket or receptacle.
	Spring Loaded		Spring contact probes are telescopic electromechanical interconnects. They typically consist of one or more contact members (often referred to as the "plunger(s)") and a helical coil spring, housed within a conductive tube (normally termed a "barrel").
	Other		Other unlisted contact types.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Contact Plating		The contacts of a connector are conductive element in a termination assembly that mates with a corresponding element for the purpose of transferring electrical energy. Plating is an overlay of a thin metallic components to improve conductivity, provide for easy soldering, or prevent rusting or corrosion.
	Your choices are...
	None		The connector contacts are not plated.
	Copper Plating		Connector is available with gold-plated contacts copper.
	Gold Plating		Connector is available with gold-plated contacts, for a more reliable electrical connection. Gold-plated contacts are more expensive than silver-plated or copper contacts, and are generally offered as an upgraded connector.
	Nickel Plating		The connector is available with nickel-plated contacts.
	Silver Plating		Connector is available with silver-plated contacts.
	Other		Other unlisted, specialty, or proprietary contact plating.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Number of Contacts		Number of conductive elements in a connector or socket that mate with a corresponding element to provide an electrical path.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Contacts Pitch		The distance from center-to-center between two consecutive pins.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Features and Standards


	Features
	Your choices are...
	Solderless		These sockets can be mounted by compression.
	ZIF Lock		Zero Insertion Force (ZIP) general sockets are a type of sockets for plugging in chips, such as the CPU. Unlike other types of chip sockets that must be forced into place, ZIF socket allow for manual installation via a cinching lever.
	Knob Lock		The package is locked with a knob.
	Screw Lock		The package is locked with a screw.
	Machined Pins		The pins of the package are machined for better contact. Machining is a manufacturing process whereby a rapidly turning solid metal rod is cut to precise tolerances.
	Open Top Socket		The socket does not have a cover.
	Auto-eject Socket		The socket has a mechanism for auto-ejection.
	Clamshell Socket		The socket has a cover that can be opened and closed. It is also known a flip-top socket.
	End Stackable		The ability for sockets to be mounted end-to-end while maintaining grid or spacing.
	Other		Other unlisted or proprietary styles.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Military Standards
	Your choices are...
	MIL-STD-105		Military standards for sample procedures and tables for inspection.
	MIL-STD-109		Military standards for quality assurance terms and definitions.
	MIL-STD-202E		Military standards for quality standards for electronics parts.
	MIL-ST-1130B		Military standards for connections
	MIL-STD-1344A		Military standards for testing electrical connectors.
	MIL-STD-45662		Military standards for calibration requirements.
	MIL-C-39024		Military standards for general specifications for connectors and interconnect devices.
	MIL-C-39029		Military standards for contacts and electrical connectors.
	MIL-S-83505		Military standards for general specifications for sockets.
	MIL-S-83734		Military standards for general specifications for DIP sockets.
	MIL-T-55155		Military standards for general specifications for solder terminals.
	Other		Other unlisted Military Standards.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

What do you want to do?
		Show All IC Sockets and Interconnect Components Companies
		Learn more about IC Sockets and Interconnect Components
		Search By Specification