IC sockets and interconnect interface or connect microelectronic semiconductor chips to printed circuit boards (PCB) or larger-scale devices. An electronic interconnect device bridges a gap between two conductors and allows the flow of current or light waves from one to the other. Electronic packaging consists of a plastic, ceramic, or metal enclosure that houses an integrated circuit (IC) on a silicon or metal die.
Electronic packaging and interconnect components are an important part of many modern electronic systems. Traditionally, an electronic package was an electrically passive part of the microelectronic component that surrounded the IC. Today, electronic packaging and interconnect components are smaller and much more complex. They are also lower voltage and lower wattage devices. Because of rapid advancements in packaging technology such as high density electronic packaging, products designers need to adopt an integrated design approach. Consequently, electronic packaging considerations must be considered from conception through each part of the product development life cycle.
IC sockets and interconnect interface or connect microelectronic semiconductor chips to printed circuit boards (PCB) or larger-scale devices. An electronic interconnect device bridges a gap between two conductors and allows the flow of current or light waves from one to the other. Electronic packaging consists of a plastic, ceramic, or metal enclosure that houses an integrated circuit (IC) on a silicon or metal die.
Electronic packaging and interconnect components are an important part of many modern electronic systems. Traditionally, an electronic package was an electrically passive part of the microelectronic component that surrounded the IC. Today, electronic packaging and interconnect components are smaller and much more complex. They are also lower voltage and lower wattage devices. Because of rapid advancements in packaging technology such as high density electronic packaging, products designers need to adopt an integrated design approach. Consequently, electronic packaging considerations must be considered from conception through each part of the product development life cycle.
Interconnect components and peripheral interconnect components are used to conserve space within end products and increase the efficient flow of current. Electronic packaging and interconnect components are also used to add convenience and flexibility to an end product. Today, the focus of research and development (R&D) efforts in the electronic packaging and interconnect component industry is the development of electronic packaging devices that will help reduce production costs, increase productivity, and reduce emissions.
Electronic packaging and interconnect components are used in many different applications and industries. Examples include telecommunications, computers, office equipment, medicine, aerospace, automobiles, appliances, and instrumentation. Electronic packaging and interconnect components are also used to fabricate complex components, such as a micro-electric-mechanical system (MEMS) device, a high density storage system, or a chip interconnection. Suppliers of electronic packaging and interconnect components meet a variety of quality standards and are located across the United States and around the world.
